Accessory Components And Quantity
Thermal pad, 9; base plate assembly, al, 1; thermal pad choke, 1; bracket assembly, al, 1; heat sink elec-ecmpnt, 4; circuit card assembly, power processor, 1; buck choke, 150uh, 1; semiconductor fet esd n-chan, lead formed, 6; transistor n-channel fet, 4; resistor, fxd film 2.0 ohm, 1pct, 50w, 1; switch, themostatic, 1; hybrid, power driver esd, 1; network snubber esd formed leads, 1; 3amps low dropout positive adi regulator; 2
